JPH0745978Y2 - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPH0745978Y2
JPH0745978Y2 JP1990103077U JP10307790U JPH0745978Y2 JP H0745978 Y2 JPH0745978 Y2 JP H0745978Y2 JP 1990103077 U JP1990103077 U JP 1990103077U JP 10307790 U JP10307790 U JP 10307790U JP H0745978 Y2 JPH0745978 Y2 JP H0745978Y2
Authority
JP
Japan
Prior art keywords
circuit board
integrated circuit
hybrid integrated
circuit device
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990103077U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459971U (en]
Inventor
慎司 平栗
芳規 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP1990103077U priority Critical patent/JPH0745978Y2/ja
Publication of JPH0459971U publication Critical patent/JPH0459971U/ja
Application granted granted Critical
Publication of JPH0745978Y2 publication Critical patent/JPH0745978Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP1990103077U 1990-09-29 1990-09-29 混成集積回路装置 Expired - Fee Related JPH0745978Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990103077U JPH0745978Y2 (ja) 1990-09-29 1990-09-29 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990103077U JPH0745978Y2 (ja) 1990-09-29 1990-09-29 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPH0459971U JPH0459971U (en]) 1992-05-22
JPH0745978Y2 true JPH0745978Y2 (ja) 1995-10-18

Family

ID=31847819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990103077U Expired - Fee Related JPH0745978Y2 (ja) 1990-09-29 1990-09-29 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPH0745978Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101178827B1 (ko) 2009-03-04 2012-09-03 후지쯔 가부시끼가이샤 프린트 기판 모듈

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631732Y2 (ja) * 1988-02-19 1994-08-22 五洋電子工業株式会社 面実装用混成集積回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101178827B1 (ko) 2009-03-04 2012-09-03 후지쯔 가부시끼가이샤 프린트 기판 모듈

Also Published As

Publication number Publication date
JPH0459971U (en]) 1992-05-22

Similar Documents

Publication Publication Date Title
US5034802A (en) Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates
JPH0745978Y2 (ja) 混成集積回路装置
JP2002204097A (ja) フレキシブル回路基板保持具及びそれを使用したフレキシブル回路基板の保持方法。
JP2592027Y2 (ja) 混成集積回路部品
JPH0631735Y2 (ja) 混成集積回路装置
JPH04147660A (ja) 電子部品
JPH07245474A (ja) 表面実装型電子部品の実装方法
CN1216418C (zh) 可设置无源组件的基板
JPH0735412Y2 (ja) 混成集積回路
JPH084696Y2 (ja) 混成集積回路
JPH04177800A (ja) 混成集積回路装置とその製造方法
JP2002280704A (ja) 表面実装用電子部品の実装構造および実装方法
JPS6141225Y2 (en])
JP2589641Y2 (ja) 混成集積回路装置
JP2697656B2 (ja) チップ部品立体実装用ソケット
JPH0652101U (ja) 表面実装用電子部品
JPH02309601A (ja) チップ部品の構造及びチップ部品の取付方法
JPS6236316Y2 (en])
JPH0525762U (ja) 多層基板
JPH0462775A (ja) 表面実装用電子部品
JP2004311583A (ja) 混成集積回路装置
JPH0964533A (ja) 混成集積回路装置
JPH01146391A (ja) 混成集積回路装置
JPH0621276U (ja) セラミックコンデンサの実装
JPH0672249U (ja) 集積回路装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees